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Transaction Code: MMP1
Description: Create Maintenance Assembly &
Release: S/4HANA and ECC 6
Menu Path:
Program: SAPMMG01
Screen: 1000
Authorization Object: M_MATE_STA
Development Package: MG
Package Description: Application development R/3 material master prior to 3.0
Parent Package: APPL
Module/Component: LO-MD-MM
Description: Material Master
amp; BOM Overview: MMP1 is a SAP transaction code used to create maintenance assemblies and bills of materials (BOMs). It is part of the SAP Plant Maintenance (PM) module and is used to create assemblies and BOMs for maintenance orders. Functionality: MMP1 allows users to create assemblies and BOMs for maintenance orders. This includes creating the assembly structure, assigning components to the assembly, and creating the BOM. The transaction code also allows users to view existing assemblies and BOMs, as well as edit them if necessary. Step-by-step How to Use: To use MMP1, users must first enter the transaction code into the SAP command field. This will open up the Create Maintenance Assembly & BOM screen. From here, users can enter the assembly number, description, and other relevant information. Once this is done, users can then assign components to the assembly and create the BOM. Other Recommendations: When using MMP1, it is important to ensure that all relevant information is entered correctly. This includes entering the correct assembly number, description, and components. Additionally, it is important to double-check that all components are assigned correctly before creating the BOM.
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